LaunchBusinessSeptember 17, 2026

Huawei moves Ascend 960DT AI chip launch up to Q1 2027

Read original source →technode.com

Huawei said at Huawei Connect 2026 that the Ascend 960DT is now planned for Q1 2027, pulled forward from Q3 2027, with the 960PR following in Q3. The NPO-based Ascend 960 SuperPoD uses 4,096 chips for up to 8 EFLOPS FP8 and 1PB HBM.

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1 day · 5 reports · 1 community post · from Sep 16

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