EventBusinessOctober 14, 2026

SUNMMIO raises nearly RMB 2B for 3D-stacked AI inference chips

Read original source →technode.com

Beijing-based SUNMMIO closed Pre-A2 and Series A rounds led by state-backed investors including Yizhuang State Investment, bringing its total raised over the past year to nearly RMB 2 billion. Its first-generation A4E chip taped out in June, stacking eight memory wafers over a logic wafer for a stated 16 TB/s memory bandwidth.

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