Micron: HBM requires 3x wafer area of DDR5

At Hot Chips 2026, Micron's HBM Design Architecture Fellow Raghu Sreeramaneni said HBM needs about three times the wafer area of DDR5 for the same capacity, and the ratio won't improve. HBM4 uses 256 memory banks vs DDR5's 32, with 2,048 I/Os and pin speeds over 11 Gbit/s.

Featured · Raghu Sreeramaneni